Dicing Die Attach Film Market Key Takeaways
- North America dominated the global market with the largest market share of 35% in 2024
- Asia Pacific is projected to witness the fastest growth in the coming years.
- By material type, the epoxy-based segment held the largest market share in 2024.
- By material type, the polyimide-based segment is expected to grow at the fastest CAGR during the forecast period.
- By adhesive type, the thermosetting adhesives segment contributed the highest market share in 2024.
- By application, the semiconductor packaging segment captured the biggest market share in 2024.
- By application, the LED packaging segment is anticipated to expand at a significant CAGR in the foreseeable future.
- By form, the film roll segment generated the major market share in 2024.
- By form, the sheet segment is projected to grow at a rapid pace between 2025 and 2034.
- By end-use, the consumer electronics segment held the largest market share in 2024.
- By end-use, the automotive segment is likely to grow at a significant rate during the projection period.
Dicing Die Attach Film Market Overview
The Dicing Die Attach Film market, when segmented by film type, primarily includes thermal release films and non-thermal release films. These films serve a dual function in semiconductor manufacturing: assisting with wafer dicing and providing adhesive support to fix semiconductor dies. Thermal release films are particularly favored in applications requiring clean separation after dicing, which is crucial for high-precision chip production.
The demand for thermal release films is increasing as they provide ease of die removal and reduce contamination. Non-thermal release films, while still widely used, are more traditional and are gradually being replaced in advanced packaging applications. As manufacturing processes become more precise and wafer sizes shrink, the adoption of film types that ensure minimal mechanical stress and high bonding performance is accelerating.
Dicing Die Attach Film Market Drivers
One of the key drivers for the growth of thermal release films in this market is the rising demand for ultra-thin semiconductor wafers, which are essential for compact consumer electronics and wearable devices. These films support high-temperature processes and allow for clean detachment without damaging the die.
dditionally, the trend toward more integrated and multi-functional semiconductor devices necessitates materials that offer both dicing support and reliable adhesion. Manufacturers prefer thermal release films due to their superior performance during wafer singulation and handling.
Dicing Die Attach Film Market Opportunities
Opportunities in this segment lie in the development of hybrid films that combine the benefits of thermal release with other features like UV-responsiveness or static control. As chip designs become more complex and delicate, film manufacturers have the chance to innovate in product formulation to meet evolving needs. The integration of automation in die attach processes also creates space for next-generation films that align with high-speed, high-throughput manufacturing lines.
Dicing Die Attach Film Market Challenges
Despite their advantages, thermal release films face challenges related to cost and process compatibility. These films are generally more expensive than conventional options and may require specialized equipment for application and removal.
Additionally, achieving uniform release strength and ensuring residue-free detachment continue to be technological hurdles. For non-thermal films, the challenge lies in their declining relevance, as they are often incompatible with the thin-wafer processes now common in advanced packaging.
Dicing Die Attach Film Market Regional Insights
Asia-Pacific dominates this market segment, with countries like Japan and South Korea leading in the development and adoption of advanced thermal release films. Japan, in particular, has a strong reputation for producing high-quality films used in precision applications.
North America is also an important region, with key players investing in domestic semiconductor production. Europe, while smaller in share, is experiencing steady growth due to increasing applications in automotive electronics.
Dicing Die Attach Film Market Recent Developments
Recent advancements in film type focus on refining thermal release mechanisms to improve efficiency and reduce stress on wafers. Manufacturers are also developing films that operate effectively across wider temperature ranges and are compatible with newer dicing technologies such as stealth laser dicing. Collaborations between film manufacturers and semiconductor equipment companies are becoming common, aimed at improving integration and overall process reliability.
- In April 2023, Resonac Corporation announced a plan to increase its capacity to produce “Dicing Die Bonding Film,” which is a two-in-one adhesive film with the functions for both dicing tape and die bonding film used in semiconductor packaging process, at the Company’s Goi Plant (Kashima) located in Kamisu City, Ibaraki Prefecture, Japan.
Dicing Die Attach Film Market Companies
- Nitto Denko Corporation
- Bostik
- Daifuku Co. Ltd.
- DIC Corporation
- Dow Inc.
- Sumitomo Bakelite Company
- Dongguan Huanxuan Technology
- Avery Dennison
- Sealed Air Corporation
- 3M Company
- Kitamura Corporation
- Alpha Assembly Solutions
- Adhesive Technologies
- B. Fuller
- Henkel AG
Segments Covered in the Report
By Material Type
- Epoxy Based
- Polyimide Based
- Silicone Based
By Adhesive Type
- Thermosetting Adhesives
- Thermoplastic Adhesives
By Application
- Semiconductor Packaging
- LED Packaging
- Power Devices
By Form
- Film Roll
- Sheet
- Custom Shapes
By End-use
- Consumer Electronics
- Automotive
- Telecommunications
By Region
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
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